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Radix-4 and radix-8 booth encoded interleaved modular multipliers over general F<inf>p</inf>

Type: Conference Paper

Author : Javeed, K.; Xiaojun Wang

Publisher: IEEE

Year: 2014

فرمولاسیون نان سورگوم بدون گلوتن با استفاده از صمغ کربوکسی متیل سلولز (CMC)و بالنگو شیرازی

Type: Conference Paper

Author : بهاره صحرائیان; محمدباقر حبیبی نجفی; مهدی کریمی; محمدحسین حدادخداپرست; مهدی قیافه داوودی; فریبا نقی پور; bahareh sahraiyan; Mohammad B Habibi Najafi; Mohammad Hossein Haddad khodaparast; fariba naghi poor

Year: 2012

Abstract:

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( 1/0 0/6 0/3 ) ( 1/5 1/0 0/5 ) ...

Failure behaviors of Sn-0.3Ag-0.7Cu solder joint under creep and current stressing

Type: Conference Paper

Author : Lei Qiao; Yong Zuo; Limin Ma; Yutian Shu; Fu Guo

Publisher: IEEE

Year: 2014

Electron Spin Resonance Spectra of <formula formulatype="inline"> <img src="/images/tex/21308.gif" alt="{\\hbox {La}}_{0.7}{\\hbox {Cd}}_{0.3}({\\hbox {Mn}},{\\hbox {Co}}){\\hbox {O}}_{3}"> </formula> Perovskites

Type: Journal Paper

Author : Phan, T.L.; Thanh, T.D.; Phan, M.H.; Yu, S.C.

Publisher: IEEE

Year: 2014

High-power in-phase coherently coupled VCSEL array based on proton implantation

Type: Journal Paper

Author : Meng Xun; Chen Xu; Yiyang Xie; Yanxu Zhu; Mingming Mao; Kun Xu; Jun Wang; Jie Liu; Hongda Chen

Publisher: IET

Year: 2014

A Complementary Dual-Contact MEMS Switch Using a “Zipping” Technique

Type: Journal Paper

Author : Yong-Ha Song; Min-Wu Kim; Min-Ho Seo; Jun-Bo Yoon

Publisher: IEEE

Year: 2014

Current Interruption in Air for a Medium-Voltage Load Break Switch

Type: Journal Paper

Author : Jonsson, Erik; Aanensen, Nina Sasaki; Runde, Magne

Publisher: IEEE

Year: 2014

Is Conductive Adhesive Bonding Suited for the Die-Attachment of Power Devices?

Type: Conference Paper

Publisher: IEEE

Year: 2014

Implications for operator interactions in an agent supervisory control relationship

Type: Conference Paper

Author : Clauss, S. , Schulte, A.

Publisher: IEEE

Year: 2014

NORA: Network Oriented Resource Allocation for Data Intensive Applications in the Cloud Environment

Type: Conference Paper

Publisher: IEEE

Year: 2014

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Radix-4 and radix-8 booth encoded interleaved modular multipliers over general F<inf>p</inf>

فرمولاسیون نان سورگوم بدون گلوتن با استفاده از صمغ کربوکسی متیل سلولز (CMC)و بالنگو شیرازی

Failure behaviors of Sn-0.3Ag-0.7Cu solder joint under creep and current stressing

Electron Spin Resonance Spectra of <formula formulatype="inline"> <img src="/images/tex/21308.gif" alt="{\\hbox {La}}_{0.7}{\\hbox {Cd}}_{0.3}({\\hbox {Mn}},{\\hbox {Co}}){\\hbox {O}}_{3}"> </formula> Perovskites

High-power in-phase coherently coupled VCSEL array based on proton implantation

A Complementary Dual-Contact MEMS Switch Using a “Zipping” Technique

Current Interruption in Air for a Medium-Voltage Load Break Switch

Is Conductive Adhesive Bonding Suited for the Die-Attachment of Power Devices?

Implications for operator interactions in an agent supervisory control relationship

NORA: Network Oriented Resource Allocation for Data Intensive Applications in the Cloud Environment

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Radix-4 and radix-8 booth encoded interleaved modular multipliers over general F<inf>p</inf>

فرمولاسیون نان سورگوم بدون گلوتن با استفاده از صمغ کربوکسی متیل سلولز (CMC)و بالنگو شیرازی

Failure behaviors of Sn-0.3Ag-0.7Cu solder joint under creep and current stressing

Electron Spin Resonance Spectra of <formula formulatype="inline"> <img src="/images/tex/21308.gif" alt="{\\hbox {La}}_{0.7}{\\hbox {Cd}}_{0.3}({\\hbox {Mn}},{\\hbox {Co}}){\\hbox {O}}_{3}"> </formula> Perovskites

High-power in-phase coherently coupled VCSEL array based on proton implantation

A Complementary Dual-Contact MEMS Switch Using a &#x201C;Zipping&#x201D; Technique

Current Interruption in Air for a Medium-Voltage Load Break Switch

Is Conductive Adhesive Bonding Suited for the Die-Attachment of Power Devices?

Implications for operator interactions in an agent supervisory control relationship

NORA: Network Oriented Resource Allocation for Data Intensive Applications in the Cloud Environment

A Complementary Dual-Contact MEMS Switch Using a “Zipping” Technique